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Jie OUYANG, Bin LI, Shihua GONG
《机械工程前沿(英文)》 2013年 第8卷 第2期 页码 118-126 doi: 10.1007/s11465-013-0253-y
To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.
关键词: LED chip sorter multi-domain modeling and simulation parameter optimization modelica language
陈晓霞,张霞 ,刘荣辉,刘元红,周裔朋,庄卫东
《中国工程科学》 2020年 第22卷 第2期 页码 71-78 doi: 10.15302/J-SSCAE-2020.02.011
随着人们对照明品质要求的提高,全光谱发光二极管(LED)照明成为发展热点。本文对全光谱 LED 用关键材料——荧光粉进行了详细分析,对比了每种体系的发光性能并给出了各类型的代表材料,重点阐述了紫光–近紫外光激发的多种颜色荧光粉的优劣势、研究进展以及实际应用情况可重点突破适合紫光–近紫光激发高光效和高热稳定性的宽谱蓝粉、青粉、黄绿粉、黄粉、长波红粉以及单一基质白光荧光粉的制备和应用技术,开发与现有应用产品体系相匹配的高效及连续化制备技术,由此促进全光谱 LED
“新一代绿色照明高端制造装备自主发展战略研究”课题组
《中国工程科学》 2017年 第19卷 第3期 页码 142-148 doi: 10.15302/J-SSCAE-2017.03.020
本文论述了我国发光二极管(LED)照明产业高端制造装备的已有成就和存在的问题,分析了我国LED照明产业高端制造装备所面临的机遇和挑战,提出我国LED照明产业高端制造装备自主发展的战略目标,并从形成LED照明产业生态的视角,研究成立国家制造装备创新平台、完善市场化运作机制、构建创新驱动发展的政策环境和公平竞争的市场环境等战略路径。
UV-LED/P25-based photocatalysis for effective degradation of isothiazolone biocide
《环境科学与工程前沿(英文)》 2021年 第15卷 第5期 doi: 10.1007/s11783-020-1379-x
• UV-LED with shorter wavelength was beneficial for photocatalytic degradation.
关键词: Degradation Photocatalytic LED CMIT P25
Solar photovoltaic fed dual input LED lighting system with constant illumination control
Kinattingal SUNDARESWARAN,Kevin Ark KUMAR,Payyalore Raman VENKATESWARAN,Sankaran PALANI
《能源前沿(英文)》 2016年 第10卷 第4期 页码 473-478 doi: 10.1007/s11708-016-0420-z
Research and Practice of Meta-synthesis Management for the Government-led Urban Complex Construction
Ru-gui Chen,Jia-meng Chen
《工程管理前沿(英文)》 2014年 第1卷 第1期 页码 52-61 doi: 10.15302/J-FEM-2014008
关键词: government-led construction project urban complex meta-synthesis management sustainable development benefit maximization
Flexible resonant tank for a combined converter to achieve an HPS and LED compatible driver
Jin HU,Hui-pin LIN,Zheng-yu LU,Feng-wu ZHOU
《信息与电子工程前沿(英文)》 2015年 第16卷 第8期 页码 679-693 doi: 10.1631/FITEE.1500054
关键词: High pressure sodium (HPS) Light emitting diode (LED) Compatible driver Ballast
Detection of solder bump defects on a flip chip using vibration analysis
Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO
《机械工程前沿(英文)》 2012年 第7卷 第1期 页码 29-37 doi: 10.1007/s11465-012-0314-7
Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.
关键词: flip chip defect detection ultrasonic excitation vibration analysis
Effects of red and blue LEDs on
Lili CHEN, Xuzhang XUE, Yadong YANG, Fei CHEN, Jie ZHAO, Xiquan WANG, Alam Tariful KHAN, Yuegao HU
《农业科学与工程前沿(英文)》 2018年 第5卷 第2期 页码 197-205 doi: 10.15302/J-FASE-2018224
关键词: blue LED microtuber plant tissue culture potato plantlets in vitro red LED
LED灯具温度应力加速老化截止时间的确定 Article
Jian HAO, Lei JING, Hong-liang KE, Yao WANG, Qun GAO, Xiao-xun WANG, Qiang SUN, Zhi-jun XU
《信息与电子工程前沿(英文)》 2017年 第18卷 第10期 页码 1678-1678 doi: 10.1631/FITEE.1500483
General framework and case study of China’s LED industry
Bin GUO, Peng DING, Frans J. A. M. GREIDANUS, Wen (Helena) LI
《工程管理前沿(英文)》 2021年 第8卷 第2期 页码 284-309 doi: 10.1007/s42524-019-0085-5
Single-chip 3D electric field microsensor
Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 581-590 doi: 10.1007/s11465-017-0454-x
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.
关键词: electric field microsensor three-dimensional single-chip in-plane rotation
刘虹,陈良惠
《中国工程科学》 2011年 第13卷 第6期 页码 39-43
在详细分析国内外半导体照明产业发展现状和趋势的基础上,提出了我国发展半导体照明的技术路线,给出了不同发展情景下,我国中长期半导体照明节能潜力的预测结果,并对我国半导体照明发展战略提出了若干政策建议。
Development of an electrorheological chip and conducting polymer based sensor
Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,
《机械工程前沿(英文)》 2009年 第4卷 第4期 页码 472-472 doi: 10.1007/s11465-009-0077-y
SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS
《农业科学与工程前沿(英文)》 2023年 第10卷 第3期 页码 448-457 doi: 10.15302/J-FASE-2023490
● Low-value biowaste including wood chip and potato peel was valorized to syngas.
关键词: Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip
标题 作者 时间 类型 操作
Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter
Jie OUYANG, Bin LI, Shihua GONG
期刊论文
Solar photovoltaic fed dual input LED lighting system with constant illumination control
Kinattingal SUNDARESWARAN,Kevin Ark KUMAR,Payyalore Raman VENKATESWARAN,Sankaran PALANI
期刊论文
Research and Practice of Meta-synthesis Management for the Government-led Urban Complex Construction
Ru-gui Chen,Jia-meng Chen
期刊论文
Flexible resonant tank for a combined converter to achieve an HPS and LED compatible driver
Jin HU,Hui-pin LIN,Zheng-yu LU,Feng-wu ZHOU
期刊论文
Detection of solder bump defects on a flip chip using vibration analysis
Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO
期刊论文
Effects of red and blue LEDs on
Lili CHEN, Xuzhang XUE, Yadong YANG, Fei CHEN, Jie ZHAO, Xiquan WANG, Alam Tariful KHAN, Yuegao HU
期刊论文
LED灯具温度应力加速老化截止时间的确定
Jian HAO, Lei JING, Hong-liang KE, Yao WANG, Qun GAO, Xiao-xun WANG, Qiang SUN, Zhi-jun XU
期刊论文
General framework and case study of China’s LED industry
Bin GUO, Peng DING, Frans J. A. M. GREIDANUS, Wen (Helena) LI
期刊论文
Single-chip 3D electric field microsensor
Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA
期刊论文
Development of an electrorheological chip and conducting polymer based sensor
Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,
期刊论文